US 11,745,291 B2
Apparatus and method for processing substrate
Ohyeol Kwon, Chungcheongnam-do (KR); Jun Keon Ahn, Sejong-si (KR); and Byungsun Bang, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Apr. 29, 2020, as Appl. No. 16/862,086.
Claims priority of application No. 10-2019-0050340 (KR), filed on Apr. 30, 2019.
Prior Publication US 2020/0346304 A1, Nov. 5, 2020
Int. Cl. B23K 26/362 (2014.01); G02B 27/14 (2006.01); G02B 27/09 (2006.01); G02B 26/10 (2006.01); B23K 26/06 (2014.01); B23K 26/082 (2014.01); B23K 26/402 (2014.01); B23K 26/0622 (2014.01); B23K 103/00 (2006.01)
CPC B23K 26/362 (2013.01) [B23K 26/0604 (2013.01); B23K 26/0622 (2015.10); B23K 26/0626 (2013.01); B23K 26/082 (2015.10); B23K 26/402 (2013.01); G02B 26/10 (2013.01); G02B 27/09 (2013.01); G02B 27/14 (2013.01); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08)] 8 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, the apparatus comprising:
a support unit configured to support the substrate including a film to be removed;
a laser generation unit configured to generate a laser beam to process the film to be removed;
a beam splitter configured to split the laser beam emitted from the laser generation unit and guided to the beam splitter into a first laser beam travelling along a first path toward an upper edge of the substrate and an entirety of a remaining laser beam to a second laser beam travelling along a second path toward a lower edge of the substrate;
a first beam shaping unit provided on the first path and configured to shape the first laser beam;
a second beam shaping unit provided on the second path and configured to shape the second laser beam;
a mirror located outside of the beam splitter in an exit path of the remaining laser beam to change a direction of the remaining laser beam toward the second beam shaping unit;
a first beam scanning unit provided downstream of the first beam shaping unit on the first path and configured to apply the first laser beam that is completely exited from the first beam shaping unit to the upper edge of the substrate in a manner of scanning; and
a second beam scanning unit provided downstream of the second beam shaping unit on the second path and configured to apply the second laser beam that is completely exited from the second beam shaping unit to the lower edge of the substrate in the manner of scanning,
wherein a beam shape of the first laser beam shaped by the first beam shaping unit differs from a beam shape of the second laser beam shaped by the second beam shaping unit.