CPC B22F 3/003 (2013.01) [B22F 3/10 (2013.01); B22F 10/10 (2021.01); B33Y 40/20 (2020.01); B22F 10/14 (2021.01); B22F 2003/1042 (2013.01); B22F 2998/10 (2013.01)] | 13 Claims |
1. An apparatus for supporting a 3D printed object during sintering, comprising:
a pin array support frame comprising a plurality of apertures;
an array of pins disposed in the plurality of apertures; and
a pin adjustment device coupled to at least some of the pins in the array of pins, wherein the pin adjustment device comprises a plate disposed at a bottom of the pin array support frame to enclose a thermally responsive support material between the plate and a bottom surface of the array of pins, wherein the thermally responsive support material shrinks during sintering to cause the array of pins to retract array in response to the sintering.
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