US 11,745,231 B2
Cleaning method and processing apparatus
Masami Oikawa, Iwate (JP); Tomoya Hasegawa, Iwate (JP); and Koji Sasaki, Yamanashi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Oct. 26, 2022, as Appl. No. 17/973,876.
Application 17/973,876 is a division of application No. 17/411,372, filed on Aug. 25, 2021, granted, now 11,534,805.
Claims priority of application No. 2020-144871 (JP), filed on Aug. 28, 2020.
Prior Publication US 2023/0047426 A1, Feb. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B08B 9/093 (2006.01); B08B 13/00 (2006.01)
CPC B08B 9/093 (2013.01) [B08B 13/00 (2013.01); B08B 2209/08 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A cleaning method comprising:
supplying a cleaning gas in a processing container while continuously increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby executing a cleaning of the processing container by removing a film deposited in the processing container; and
detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the executing the cleaning, for each pressure of the plurality of time points,
wherein the executing the cleaning is repeated performed when the time-dependent data of the concentration of the predetermined gas generated in the continuously increasing the pressure changes from an increasing state to a decreasing state after exceeding a threshold value.