US 11,116,075 B2
Component carrier comprising dielectric structures with different physical properties
Kim Liu, KunShan (CN); Nick Xin, Shanghai (CN); Howard Li, Shanghai (CN); and Henry Guo, Suqian (CN)
Assigned to AT&S (China) Co. Ltd., Shanghai (CN)
Filed by AT&S (China) Co. Ltd., Shanghai (CN)
Filed on Jan. 29, 2020, as Appl. No. 16/775,794.
Claims priority of application No. 201910156775.0 (CN), filed on Mar. 1, 2019.
Prior Publication US 2020/0281071 A1, Sep. 3, 2020
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01)
CPC H05K 1/0271 (2013.01) [H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H05K 1/036 (2013.01); H05K 1/185 (2013.01); H05K 3/0011 (2013.01)] 17 Claims
OG exemplary drawing
 
16. A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
a component embedded in an encapsulant in the stack;
wherein the plurality of electrically insulating layer structures further comprises a first dielectric structure and a second dielectric structure differing from each other concerning at least one physical property; and
at least one opening provided in the stack and filled by a filling material, wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the component carrier is yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.