US 11,737,237 B2
Liquid cooling design for peripheral electronics
Tianyi Gao, San Jose, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by BAIDU USA LLC, Sunnyvale, CA (US)
Filed on Feb. 3, 2021, as Appl. No. 17/166,175.
Prior Publication US 2022/0248565 A1, Aug. 4, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 7/16 (2006.01); H05K 7/12 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 7/12 (2013.01); H05K 7/16 (2013.01); H05K 7/20272 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A cooling apparatus configured for cooling a peripheral circuit board having a peripheral device mounted thereon, the cooling apparatus comprising:
a cooling frame;
at least one cooling device mounted onto the cooling frame;
a plurality of cooling hoses connected to the at least one cooling device;
a hinge attached to one side of the cooling frame;
a cushion frame rotatably attached on one side to the hinge;
a cushion arrangement attached to the cushion frame;
a locking arrangement configured to lock the cooling frame to the cushion frame in a closed position, wherein when the cooling frame is locked to the cushion frame in the closed position:
the at least one cooling device is in thermal contact with the peripheral device, and
the at least one cooling device, the peripheral device, and the peripheral circuit board are sandwiched between the cooling frame and the cushion arrangement; and
a contact layer sandwiched between the cushion arrangement and the peripheral circuit board when the cooling frame is locked to the cushion frame in the closed position.