US 11,737,203 B2
Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
Scott Brandenburg, Kokomo, IN (US); and David Wayne Zimmerman, Noblesville, IN (US)
Assigned to Aptiv Technologies Limited, St. Michael (BB)
Filed by Aptiv Technologies Limited, St. Michael (BB)
Filed on Jun. 3, 2022, as Appl. No. 17/805,444.
Application 17/805,444 is a continuation of application No. 17/023,258, filed on Sep. 16, 2020, granted, now 11,382,205.
Prior Publication US 2022/0304139 A1, Sep. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01); G01S 7/02 (2006.01)
CPC H05K 1/0204 (2013.01) [H05K 1/0209 (2013.01); G01S 7/027 (2021.05)] 20 Claims
OG exemplary drawing
 
1. An assembly comprising:
a printed circuit board (PCB) that includes one or more components and a thermally-conductive material that covers at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite the first surface of the PCB; and
a heatsink shield that includes multiple dimples in direct mechanical contact with the thermally-conductive material of the PCB on both the first surface and second surface of the PCB, the heatsink shield being adjacent to the one or more components and the first surface of the PCB, the heatsink shield being configured to distribute thermal energy produced at least in part by the one or more components to a housing positioned adjacent to the second surface of the PCB.