US 11,735,887 B2
Semiconductor laser and method of production for optoelectronic semiconductor parts
Jörg Erich Sorg, Regensburg (DE); Harald König, Bernhardswald (DE); Alfred Lell, Maxhütte-Haidhof (DE); Florian Peskoller, Ingolstadt (DE); Karsten Auen, Regensburg (DE); Roland Schulz, Regensburg (DE); Herbert Brunner, Sinzing (DE); Frank Singer, Regenstauf (DE); and Roland Hüttinger, Kaufering (DE)
Assigned to OSRAM OLED GMBH, Regensburg (DE)
Appl. No. 16/754,723
Filed by OSRAM OLED GmbH, Regensburg (DE)
PCT Filed Oct. 8, 2018, PCT No. PCT/EP2018/077313
§ 371(c)(1), (2) Date Apr. 8, 2020,
PCT Pub. No. WO2019/072759, PCT Pub. Date Apr. 18, 2019.
Claims priority of application No. 102017123798.4 (DE), filed on Oct. 12, 2017.
Prior Publication US 2020/0313399 A1, Oct. 1, 2020
Int. Cl. H01S 5/028 (2006.01); H01S 5/0236 (2021.01); H01S 5/02253 (2021.01); H01S 5/02326 (2021.01); H01S 5/00 (2006.01)
CPC H01S 5/028 (2013.01) [H01S 5/0236 (2021.01); H01S 5/02253 (2021.01); H01S 5/02326 (2021.01); H01S 5/0078 (2013.01); H01S 5/0087 (2021.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor laser comprising
a carrier,
an edge-emitting laser diode which is mounted on the carrier and which has an active zone for generating laser radiation and has a facet with a radiation exit region,
a protective cover, and
an adhesive, by means of which the protective cover is fastened to the facet and to a side surface of the carrier, wherein
an average distance between a light entrance side of the protective cover and the facet is at most 15 μm,
the semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation,
the protective cover is a lens for collimation of the laser radiation and has a minimum distance from the facet of 0.1 μm, wherein a cavity is formed in the region of the active zone on the facet, said cavity is surrounded all around by the adhesive as seen in plan view of the facet, such that the radiation exit region, from which the laser radiation leaves the laser diode, is free of the adhesive, and
the cavity is evacuated or filled with at least one protective gas, wherein the cavity, seen in plan view of the facet, has an average diameter of between 3 μm and 100 μm inclusive, and a thickness of the cavity is between 0.5 μm and 20 μm inclusive, and wherein as seen in plan view of the facet, a width of the adhesive around the cavity is at least 150% of the average diameter of the cavity and also at least 30 μm.