US 11,735,597 B2
Array substrate, display panel, display device and method of manufacturing an array substrate
Wenlong Zhang, Beijing (CN); Xu Zhang, Beijing (CN); Wei Zhang, Beijing (CN); Jianfei Tian, Beijing (CN); Jingyi Xu, Beijing (CN); and Shuai Han, Beijing (CN)
Assigned to ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., Inner Mongolia (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 16/631,335
Filed by ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., Inner Mongolia (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Dec. 21, 2018, PCT No. PCT/CN2018/122608
§ 371(c)(1), (2) Date Jan. 15, 2020,
PCT Pub. No. WO2019/223299, PCT Pub. Date Nov. 28, 2019.
Claims priority of application No. 201810509233.2 (CN), filed on May 24, 2018.
Prior Publication US 2021/0257389 A1, Aug. 19, 2021
Int. Cl. H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/1345 (2006.01)
CPC H01L 27/124 (2013.01) [G02F 1/13458 (2013.01); G02F 1/13629 (2021.01); H01L 27/1237 (2013.01); H01L 27/1244 (2013.01); H01L 27/1259 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a substrate,
three metal layers stacked on the substrate,
a plurality of signal line leads disposed in a peripheral area of the array substrate, and
a plurality of bonding pads disposed in the peripheral area, wherein
the plurality of signal line leads are distributed in at least two of the three metal layers;
the plurality of signal line leads are connected to an integrated circuit in a driving circuit through the plurality of bonding pads, and each of the plurality of bonding pads is connected to a corresponding signal line lead of the plurality of signal line leads; and
the plurality of bonding pads are disposed in a same layer and are divided into N subsets, N is equal to a number of metal layers in which the plurality of signal line leads are distributed, the plurality of bonding pads are arranged in N different lines that are parallel to each other, each subset of bonding pads are arranged in a respective line of the N different lines such that each subset of bonding pads extend to different lengths with respect to one another, and signal line leads connected to the bonding pads of each subset are distributed in a same metal layer.