CPC H01L 23/645 (2013.01) [H01F 17/0006 (2013.01); H01F 17/04 (2013.01); H01F 27/32 (2013.01); H01F 41/041 (2013.01); H01F 41/12 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01F 2017/0086 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01)] | 23 Claims |
1. An inductor, comprising:
a plurality of plated-through-hole (PTH) vias in a substrate layer;
a plurality of magnetic interconnects with a plurality of openings in the substrate layer, wherein the plurality of openings of the plurality of magnetic interconnects surround the plurality of PTH vias;
an insulating layer in the substrate layer, wherein the insulating layer laterally surrounds and is in contact with an outermost surface of the plurality of magnetic interconnects;
a first conductive layer over the plurality of PTH vias, the plurality of magnetic interconnects, and the insulating layer; and
a second conductive layer below the plurality of PTH vias, the plurality of magnetic interconnects, and the insulating layer.
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