US 11,735,491 B2
Semiconductor package device
Hyunggyun Noh, Suwon-si (KR); Gun-Hee Bae, Seongnam-si (KR); Sangwoo Pae, Suwon-si (KR); Jinsoo Bae, Seongnam-si (KR); Deok-Seon Choi, Hwaseong-si (KR); and Il-Joo Choi, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 20, 2021, as Appl. No. 17/505,953.
Claims priority of application No. 10-2021-0034985 (KR), filed on Mar. 18, 2021.
Prior Publication US 2022/0301969 A1, Sep. 22, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/22 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/22 (2013.01); H01L 23/4012 (2013.01); H01L 2023/4087 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a package substrate;
an interposer on the package substrate;
a semiconductor package on the interposer; and
an under-fill between the interposer and the semiconductor package,
wherein the interposer is provided with at least one first trench at an upper portion of the interposer, the at least one first trench extending in a first direction parallel to a top surface of the package substrate,
wherein the at least one first trench vertically overlaps an edge region of the semiconductor package, and
wherein the under-fill fills at least a portion of the at least one first trench.