US 11,733,347 B2
Dual-sided radar systems and methods of formation thereof
Saverio Trotta, Munich (DE); Reinhard-Wolfgang Jungmaier, Alkoven (AT); Adrian Mikolajczak, Los Altos, CA (US); and Ashutosh Baheti, Munich (DE)
Assigned to INFINEON TECHNOLOGIES AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Feb. 12, 2021, as Appl. No. 17/175,095.
Application 17/175,095 is a division of application No. 15/724,953, filed on Oct. 4, 2017, granted, now 10,921,420.
Prior Publication US 2021/0165072 A1, Jun. 3, 2021
Int. Cl. G01S 7/03 (2006.01); G01S 13/88 (2006.01); G01S 13/66 (2006.01); G01S 13/04 (2006.01); H01Q 25/00 (2006.01)
CPC G01S 7/032 (2013.01) [G01S 13/66 (2013.01); G01S 13/88 (2013.01); G01S 13/04 (2013.01); H01Q 25/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a radar system, the method comprising:
forming a first receive antenna and a first ground plane region by patterning a first conductive layer on a first surface of a first laminate layer of a radar package;
forming a transmit antenna and a second ground plane region by patterning a second conductive layer on a second surface of the first laminate layer, the second surface being opposite the first surface;
forming a second laminate layer of the radar package over the second conductive layer;
forming a third conductive layer over the second laminate layer;
forming a second receive antenna by patterning the third conductive layer; and
attaching a radio frequency integrated circuit (RFIC) chip to the radar package, the RFIC being coupled to the transmit antenna, the first receive antenna, and the second receive antenna.