CPC G01N 19/00 (2013.01) [H05K 1/0203 (2013.01); H05K 7/2039 (2013.01)] | 12 Claims |
1. A method comprising:
providing a heatsink stack up, wherein the heatsink stack up includes a heatsink disposed on a thermal interface material, and the thermal interface material disposed on a heat generating component;
placing the heatsink stack up assembly on a support structure;
placing a compression probe into a channel on the heatsink, wherein a first end of the channel is positioned at a top surface of a body of the heatsink and a second end of the channel is positioned at a lower surface of the body of the heatsink;
initializing the compression probe to generate a compression force curve; and
verifying the presences of the thermal interface material based on the generated compression force curve.
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