US 11,733,154 B2
Thermal interface material detection through compression
Theron Lee Lewis, Rochester, MN (US); John R. Dangler, Rochester, MN (US); and David J. Braun, St. Charles, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Aug. 16, 2021, as Appl. No. 17/445,098.
Prior Publication US 2023/0048273 A1, Feb. 16, 2023
Int. Cl. G01N 19/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC G01N 19/00 (2013.01) [H05K 1/0203 (2013.01); H05K 7/2039 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method comprising:
providing a heatsink stack up, wherein the heatsink stack up includes a heatsink disposed on a thermal interface material, and the thermal interface material disposed on a heat generating component;
placing the heatsink stack up assembly on a support structure;
placing a compression probe into a channel on the heatsink, wherein a first end of the channel is positioned at a top surface of a body of the heatsink and a second end of the channel is positioned at a lower surface of the body of the heatsink;
initializing the compression probe to generate a compression force curve; and
verifying the presences of the thermal interface material based on the generated compression force curve.