CPC G01B 15/02 (2013.01) [G01N 23/223 (2013.01); G01N 23/225 (2013.01); G01N 23/2251 (2013.01); G01N 23/2273 (2013.01); G01N 23/22 (2013.01)] | 7 Claims |
1. A method of thin film characterization, the method comprising:
measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate, the first XPS and XRF intensity signals including information for the first layer and for the substrate;
determining a thickness of the first layer based on the first XPS and XRF intensity signals;
combining the information for the first layer and for the substrate to estimate an effective substrate;
measuring second XPS and XRF intensity signals for the sample, after forming a second layer above the first layer above the substrate, the second XPS and XRF intensity signals including information for the second layer, for the first layer, and for the substrate; and
determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.
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