US 11,732,880 B2
LED system without heat sink
Jacques Bordes, Sartilly-Baie-Bocage (FR)
Assigned to Agomoon SRL, Manage (BE)
Appl. No. 17/908,251
Filed by Agomoon SRL, Manage (BE)
PCT Filed Feb. 23, 2021, PCT No. PCT/IB2021/051511
§ 371(c)(1), (2) Date Aug. 31, 2022,
PCT Pub. No. WO2021/176302, PCT Pub. Date Sep. 10, 2021.
Claims priority of application No. 2002246 (FR), filed on Mar. 5, 2020.
Prior Publication US 2023/0123362 A1, Apr. 20, 2023
Int. Cl. F21V 29/87 (2015.01); F21S 4/28 (2016.01); F21Y 105/16 (2016.01); F21Y 115/10 (2016.01)
CPC F21V 29/87 (2015.01) [F21S 4/28 (2016.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08)] 7 Claims
OG exemplary drawing
 
1. A device comprising:
an insulated metal substrate (1) in a form of a straight block, a length at least twice as great as a width of the insulated metal substrate (1), which is at least twice as great as a thickness of the insulated metal substrate (1);
wherein the insulated metal substrate (1) having two larger surfaces, one of which has at least one SMD-type (Surface Mounted Device) or COB-type (Chip_on_Board) light-emitting diode (2), supplied by a connector (3);
wherein said substrate (1) is covered with a transparent or translucent heat-shrinkable sheath (4) covering diodes;
wherein ends of the substrate (1) and the sheath (4) are overmoulded by a polymer (5) electrically insulating the device.