CPC F21V 29/87 (2015.01) [F21S 4/28 (2016.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08)] | 7 Claims |
1. A device comprising:
an insulated metal substrate (1) in a form of a straight block, a length at least twice as great as a width of the insulated metal substrate (1), which is at least twice as great as a thickness of the insulated metal substrate (1);
wherein the insulated metal substrate (1) having two larger surfaces, one of which has at least one SMD-type (Surface Mounted Device) or COB-type (Chip_on_Board) light-emitting diode (2), supplied by a connector (3);
wherein said substrate (1) is covered with a transparent or translucent heat-shrinkable sheath (4) covering diodes;
wherein ends of the substrate (1) and the sheath (4) are overmoulded by a polymer (5) electrically insulating the device.
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