CPC C23C 16/50 (2013.01) [B81B 3/0018 (2013.01); H01L 21/67271 (2013.01); H01L 21/67282 (2013.01); H01L 21/67294 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95115 (2013.01); H01L 2224/95144 (2013.01); H01L 2224/95145 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01)] | 18 Claims |
1. A particles-transferring system comprising:
a first substrate comprising a first surface configured to support a plurality of particles in a non-uniform pattern, wherein the first substrate is an assembly substrate and the plurality of particles is an assembled object comprising a plurality of rows;
a particle transferring unit comprising an outer surface configured to be offset from the first surface by a first gap, wherein the particle transferring unit is configured to remove the assembled object from the first surface in response to the assembled object being within the first gap, wherein the particle transferring unit is configured to secure the assembled object to the outer surface and is configured to transfer the assembled object by, for each of the plurality of rows, removing a row of the plurality of rows from the assembly substrate and transferring the row to a second substrate while maintaining the non-uniform pattern on the second substrate, wherein the transferring unit is configured to transfer the plurality of particles and maintain the non-uniform pattern regardless of the positions of the plurality of particles, which are not predefined to fit features of the transferring unit; and
the second substrate comprising a second surface configured to be offset from the outer surface by a second gap, wherein the second substrate is a final substrate and configured to remove the assembled object from the particle transferring unit in response to the assembled object being within the second gap, wherein the assembled object is configured to be secured to the second surface;
wherein the particle transferring unit is configured to remove the plurality of particles from the assembly substrate and secure the plurality of particles via an electrical force generated at or near the outer surface of the particle transferring unit.
|