US 11,732,346 B2
Physical vapor deposition chamber and physical vapor deposition apparatus
Hongrui Guo, Beijing (CN); Bing Li, Beijing (CN); and Qiwei Huang, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 17/773,678
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Oct. 23, 2020, PCT No. PCT/CN2020/123065
§ 371(c)(1), (2) Date May 2, 2022,
PCT Pub. No. WO2021/088658, PCT Pub. Date May 14, 2021.
Claims priority of application No. 201911067926.1 (CN), filed on Nov. 4, 2019.
Prior Publication US 2022/0380887 A1, Dec. 1, 2022
Int. Cl. H01J 37/34 (2006.01); C23C 14/35 (2006.01)
CPC C23C 14/35 (2013.01) [H01J 37/3405 (2013.01); H01J 37/3488 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A physical vapor deposition (PVD) chamber, comprising a chamber body, and an upper electrode assembly being arranged in the chamber body and including:
a base plate assembly configured to carry a magnetron;
a backplate arranged at an interval with the base plate assembly; and
a connection assembly for connecting the base plate assembly to the backplate, the backplate being arranged on a side of the base plate assembly away from the magnetron;
wherein:
the connection assembly includes a connection bolt;
a bolt head of the connection bolt is connected to the base plate assembly;
a bolt is threadedly connected to the backplate, and
the bolt head is located inside the base plate assembly, an operation hole is arranged on a side of the base plate assembly away from the backplate to expose the bolt head, and an operation slot is arranged at the bolt head corresponding to the operation hole.