CPC C09K 5/14 (2013.01) [C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/22 (2013.01); C08K 3/22 (2013.01); C08K 7/18 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01)] | 10 Claims |
1. A non-curable thermally conductive material comprising:
(a) a matrix material comprising:
(i) greater than 90 weight-percent and at the same time 98 weight percent or less based on matrix material weight of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity in a range of 50 to 350 centiStokes; and
(ii) 2 to less than 10 weight-percent based on matrix material weight of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization that is greater than 300 and an organohydrogensiloxane crosslinker comprising on average 2 or more SiH groups per molecule where the ratio of the alkenyl terminated polydiorganosiloxane and organohydrogen siloxane is such that the molar ratio of SiH groups to alkenyl groups is in a range of 0.5 to 2.0;
(b) greater than 80 weight-percent and at the same time less than 95 wt % based on non-curable thermally conductive material weight of a thermally conductive filler dispersed throughout the matrix material; and
(c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains from one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization in a range of 20 to 110 and the alkoxy groups each contain from one to 12 carbon atoms dispersed in the matrix material.
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