US 11,730,451 B2
Integrated ultrasonic transducers
Janusz Bryzek, Oakland, CA (US); Sandeep Akkaraju, Wellesley, MA (US); Yusuf Haque, Woodiside, CA (US); and Joe Adam, Truckee, CA (US)
Assigned to Exo Imaging, Inc., Santa Clara, CA (US)
Filed by eXo Imaging, Inc., Redwood City, CA (US)
Filed on Jan. 22, 2021, as Appl. No. 17/155,940.
Application 17/155,940 is a continuation of application No. 15/933,309, filed on Mar. 22, 2018, granted, now 10,966,683.
Prior Publication US 2021/0137497 A1, May 13, 2021
Int. Cl. B06B 1/06 (2006.01); A61B 8/00 (2006.01); H01L 23/00 (2006.01); B06B 1/02 (2006.01); G01S 15/89 (2006.01); B81B 7/00 (2006.01)
CPC A61B 8/4494 (2013.01) [A61B 8/4488 (2013.01); B06B 1/0215 (2013.01); B06B 1/067 (2013.01); B06B 1/0622 (2013.01); B06B 1/0666 (2013.01); B06B 1/0681 (2013.01); B81B 7/0058 (2013.01); G01S 15/8938 (2013.01); G01S 15/8965 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); B06B 2201/76 (2013.01); B81B 2207/012 (2013.01); B81B 2207/053 (2013.01); B81B 2207/098 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1461 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A transducer assembly, comprising:
a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements;
a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and
a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die with the CMOS die interposed between the package and the MEMS die.