CPC A61B 8/4494 (2013.01) [A61B 8/4488 (2013.01); B06B 1/0215 (2013.01); B06B 1/067 (2013.01); B06B 1/0622 (2013.01); B06B 1/0666 (2013.01); B06B 1/0681 (2013.01); B81B 7/0058 (2013.01); G01S 15/8938 (2013.01); G01S 15/8965 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); B06B 2201/76 (2013.01); B81B 2207/012 (2013.01); B81B 2207/053 (2013.01); B81B 2207/098 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1461 (2013.01)] | 23 Claims |
1. A transducer assembly, comprising:
a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements;
a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and
a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die with the CMOS die interposed between the package and the MEMS die.
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