US 11,729,958 B1
Electromagnetic interference and/or radio frequency attenuating infrastructure insulation
Jesse William Sanders, Bethesda, MD (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jul. 22, 2022, as Appl. No. 17/814,301.
Int. Cl. H05K 9/00 (2006.01); H05K 5/06 (2006.01)
CPC H05K 9/0088 (2013.01) [H05K 5/06 (2013.01); H05K 9/0064 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for electromagnetic attenuation, the system comprising:
a first electromagnetically insulating device including a first EMI attenuation layer, the first electromagnetically insulating device includes a body material and a plurality of conductive elements in the body material, wherein the plurality of conductive elements in the body material provide electrical conductivity from the EMI attenuation layer to an external ground connector or between the EMI attenuation layer and a second EMI attenuation layer;
a second electromagnetically insulating device including a second EMI attenuation layer; and
a connection device electrically connecting the first EMI attenuation layer to the second EMI attenuation layer.