US 11,729,957 B2
Shielding film including plurality of layers and electronic device using the same
Myeonggil Lee, Gyeonggi-do (KR); Hyein Park, Gyeonggi-do (KR); Jaedeok Lim, Gyeonggi-do (KR); Jihye Moon, Gyeonggi-do (KR); Cheehwan Yang, Gyeonggi-do (KR); Jangsun Yoo, Gyeonggi-do (KR); and Kwangyong Lee, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Jun. 16, 2022, as Appl. No. 17/841,834.
Application 17/841,834 is a continuation of application No. 16/669,592, filed on Oct. 31, 2019.
Claims priority of application No. 10-2018-0132605 (KR), filed on Oct. 31, 2018.
Prior Publication US 2022/0312653 A1, Sep. 29, 2022
Int. Cl. H05K 9/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 9/0022 (2013.01) [H05K 7/20454 (2013.01); H05K 7/20509 (2013.01); H05K 9/009 (2013.01); H05K 9/0088 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board;
at least one electronic component mounted on the printed circuit board; and
a shielding film including a conductive layer and an insulation layer, the shielding film attached to at least a part of the printed circuit board and contacting an upper side surface of the at least one electronic component,
wherein the conductive layer includes a nano-conductive fiber and is electrically connected with a first ground part of the printed circuit board through the nano-conductive fiber,
wherein the insulation layer defines a hole, and
wherein a position of the hole corresponds to a position of the at least one electronic component, such that an upper side surface of the at least one electronic component directly contacts the conductive layer through the hole.