CPC H05K 7/20327 (2013.01) [H05K 7/20336 (2013.01)] | 20 Claims |
1. A cooler device comprising:
a cold plate comprising:
an array of bonding posts, each bonding post of the array of bonding posts having a first height; and
an array of fluid channels having a second height that is less than the first height, the array of bonding posts is orthogonal to the array of fluid channels, and a manifold with fluid wicking structure comprising:
a plurality of spacer elements and a plurality of mesh layers, each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement, the manifold with fluid wicking structure is in contact with the array of bonding posts.
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