US 11,729,951 B2
Heat flux micro coolers having multi-stepped features and fluid wicking
Chi Zhang, Palo Alto, CA (US); Qianying Wu, Stanford, CA (US); Muhammad Shattique, Merced, CA (US); Neda Seyedhassantehrani, Merced, CA (US); Souvik Roy, Merced, CA (US); James Palko, Merced, CA (US); Sreekant Narumanchi, Littleton, CO (US); Bidzina Kekelia, Golden, CO (US); Sougata Hazra, Stanford, CA (US); Kenneth E. Goodson, Portola Valley, CA (US); Roman Giglio, Costa Mesa, CA (US); Ercan M. Dede, Ann Arbor, MI (US); and Mehdi Asheghi, Oakland, CA (US)
Assigned to Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US); The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US); The Regents of the University of California, Merced, Merced, CA (US); and Alliance for Sustainable Energy, LLC, Golden, CO (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US); The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US); The Regents of the University of California, Merced, Merced, CA (US); and Alliance for Sustainable Energy, LLC, Golden, CO (US)
Filed on Jan. 13, 2022, as Appl. No. 17/575,071.
Prior Publication US 2023/0225082 A1, Jul. 13, 2023
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20327 (2013.01) [H05K 7/20336 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooler device comprising:
a cold plate comprising:
an array of bonding posts, each bonding post of the array of bonding posts having a first height; and
an array of fluid channels having a second height that is less than the first height, the array of bonding posts is orthogonal to the array of fluid channels, and a manifold with fluid wicking structure comprising:
a plurality of spacer elements and a plurality of mesh layers, each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement, the manifold with fluid wicking structure is in contact with the array of bonding posts.