US 11,729,910 B2
Printed circuit board and electronic component package
Chan Hoon Ko, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 2, 2021, as Appl. No. 17/189,762.
Claims priority of application No. 10-2020-0173040 (KR), filed on Dec. 11, 2020.
Prior Publication US 2022/0192017 A1, Jun. 16, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/185 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10674 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a substrate including an external connection pad; and
a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad,
wherein:
the metal post includes:
a first post portion,
a second post portion extending to the outside of the substrate in the thickness direction of the substrate, and
a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion,
the third post portion provides a lowest end portion of the metal post,
the second post portion has a width narrower than the first post portion and the third post portion, and
at least a portion of the second post portion is exposed from the first post portion.