US 11,729,909 B2
Multi-layered diamond-like carbon coating for electronic components
Thomas Matthew Selter, Blue Springs, MO (US); Justin Schlitzer, Stillwell, KS (US); and Surbhi Mahajan Du, Overland Park, KS (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed by Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed on Jul. 20, 2021, as Appl. No. 17/380,443.
Prior Publication US 2023/0025748 A1, Jan. 26, 2023
Int. Cl. H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 1/05 (2006.01); C23C 14/22 (2006.01); C23C 14/16 (2006.01); C23C 16/02 (2006.01); C23C 14/06 (2006.01); H05K 3/28 (2006.01); C23C 16/27 (2006.01)
CPC H05K 1/053 (2013.01) [C23C 14/0611 (2013.01); C23C 14/16 (2013.01); C23C 14/221 (2013.01); C23C 16/0272 (2013.01); C23C 16/276 (2013.01); H05K 1/032 (2013.01); H05K 1/0306 (2013.01); H05K 3/0044 (2013.01); H05K 3/285 (2013.01); H05K 2201/0175 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate having a multi-layer coating on an outer surface thereof, the multi-layer coating comprising:
a first layer applied directly to the outer surface of the substrate, wherein the first layer comprises diamond-like carbon (DLC) configured to mitigate metal whisker formation; and
a second layer applied on a top surface of the first layer,
wherein the second layer is a conformal coating comprising a second material configured to bind to the top surface of the first layer,
wherein the conformal coating is configured to fill any microfractures that may form in the first layer, and
wherein the first layer is doped with silicon to soften the first layer and substantially reduce formation of microfractures.