US 11,729,899 B2
Method for shielding a printed circuit board from electromagnetic interference and noise during testing
Cesar Verdugo Muñoz, Thousand Oaks, CA (US); Jorge Luis Pineda, Aliso Viejo, CA (US); Edgar Antonio Martinez, Mexicali (MX); Daniel Murillo, Mexicali (MX); and Adrian Flores Baca, Simi Valley, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Dec. 30, 2020, as Appl. No. 17/137,968.
Application 17/137,968 is a continuation of application No. 16/838,437, filed on Apr. 2, 2020, granted, now 11,051,397.
Claims priority of provisional application 62/833,064, filed on Apr. 12, 2019.
Claims priority of provisional application 62/833,125, filed on Apr. 12, 2019.
Prior Publication US 2021/0120666 A1, Apr. 22, 2021
Int. Cl. H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 9/00 (2006.01); G01R 1/18 (2006.01)
CPC H05K 1/0225 (2013.01) [G01R 1/18 (2013.01); H05K 3/34 (2013.01); H05K 3/3447 (2013.01); H05K 9/0069 (2013.01); H05K 2203/1147 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49117 (2015.01)] 10 Claims
OG exemplary drawing
 
1. A method for shielding a printed circuit board from electromagnetic interference and noise during noise figure testing, comprising:
inserting a printed circuit board with at least one radiofrequency component mounted thereon through an opening in a cover of a cavity of a housing, the cavity defined by a peripheral wall of the housing;
attaching one or more radiofrequency connectors to the peripheral wall so that a pin of each radiofrequency connectors substantially aligns with an electrical contact on the printed circuit board;
soldering the pin of the one or more radiofrequency connectors to its corresponding electrical contact on the printed circuit board; and
sealing the opening in the cover of the housing with a tool to at least partially seal the cavity.