US 11,729,499 B2
Electronic device and method for connecting ground node to camera module
Changrim Yu, Suwon-si (KR); Yongwoog Shin, Suwon-si (KR); Yonghyun Park, Suwon-si (KR); and Hyunseung Yoon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Appl. No. 17/425,209
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
PCT Filed Jan. 22, 2020, PCT No. PCT/KR2020/001064
§ 371(c)(1), (2) Date Jul. 22, 2021,
PCT Pub. No. WO2020/153738, PCT Pub. Date Jul. 30, 2020.
Claims priority of application No. 10-2019-0009307 (KR), filed on Jan. 24, 2019.
Prior Publication US 2022/0086328 A1, Mar. 17, 2022
Int. Cl. H04N 23/661 (2023.01); H04N 23/57 (2023.01); H04N 23/65 (2023.01)
CPC H04N 23/661 (2023.01) [H04N 23/57 (2023.01); H04N 23/65 (2023.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device comprising:
an antenna;
a camera module;
at least one capacitor;
a switching circuit; and
a controller which is operatively coupled to the antenna, the camera module, the at least one capacitor, and the switching circuit, and
wherein the controller is configured to:
identify a wireless signal related to the antenna in a state where the at least one capacitor connected in parallel with a power supply node inputted to the camera module is connected to a first node by the switching circuit, and in response to the identification of the wireless signal, control the switching circuit to connect the at least one capacitor to a second node distinguished from the first node,
wherein the first node is a first ground node which is connected with at least one circuit element for processing an analogue signal within the camera module, and
wherein the second node is a second ground node which is connected with at least one circuit element for processing a digital signal within the camera module.