US 11,728,909 B2
Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuits
Jawad Nasrullah, Mountain View, CA (US); Omar Alnaggar, Mountain View, CA (US); Hanfeng Wang, Mountain View, CA (US); and Mohamed Sameh Mahmoud, Mountain View, CA (US)
Assigned to Shenzhen Chipuller Chip Technology Co., LTD, Shenzhen (CN)
Filed by Shenzhen Chipuller Chip Technology Co., LTD., Shenzhen (CN)
Filed on Apr. 12, 2022, as Appl. No. 17/658,981.
Application 17/658,981 is a continuation of application No. 17/072,927, filed on Oct. 16, 2020, granted, now 11,329,734.
Claims priority of provisional application 62/931,971, filed on Nov. 7, 2019.
Prior Publication US 2022/0239389 A1, Jul. 28, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 17/21 (2015.01); H04B 17/19 (2015.01); H04B 17/11 (2015.01); H04B 1/40 (2015.01); H01L 23/528 (2006.01); H04B 1/44 (2006.01)
CPC H04B 17/21 (2015.01) [H01L 23/528 (2013.01); H04B 1/44 (2013.01); H04B 17/11 (2015.01); H04B 17/19 (2015.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an active interposer, wherein the active interposer includes controllable switches; and
an RF silicon on the active interposer, wherein the RF silicon comprises RF transceiver chiplets in a daisy chain configuration, and wherein the controllable switches are controlled to couple the RF transceiver chiplets in a test configuration.