US 11,728,782 B2
Resonator device and method for manufacturing resonator device
Masahiro Fujii, Shiojiri (JP); and Koji Kitahara, Ina (JP)
Assigned to SEIKO EPSON CORPORATION
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jul. 26, 2022, as Appl. No. 17/873,204.
Claims priority of application No. 2021-122329 (JP), filed on Jul. 27, 2021.
Prior Publication US 2023/0033936 A1, Feb. 2, 2023
Int. Cl. H03H 3/02 (2006.01); H03B 5/32 (2006.01); H03B 5/04 (2006.01)
CPC H03H 3/02 (2013.01) [H03B 5/04 (2013.01); H03B 5/32 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A resonator device comprising:
a base including a semiconductor substrate having a first surface and a second surface in a front-back relationship with each other;
a resonator element disposed at the first surface side; and
a lid to be bonded to the first surface of the base, the lid and the base forming a cavity for accommodating the resonator element, wherein
an integrated circuit is disposed at the semiconductor substrate, the integrated circuit including:
an oscillation circuit electrically coupled to the resonator element;
a memory circuit configured to store a reference value of an output characteristic of the resonator element; and
a determination circuit configured to compare a detection value of the output characteristic of the resonator element with the reference value and determine an airtight state inside the cavity based on a comparison result.