US 11,728,713 B2
Power conversion device
Hiroyasu Sugiura, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on May 14, 2020, as Appl. No. 16/874,652.
Claims priority of application No. 2019-093613 (JP), filed on May 17, 2019.
Prior Publication US 2020/0366169 A1, Nov. 19, 2020
Int. Cl. H02K 11/40 (2016.01); H02K 11/33 (2016.01); H02K 11/215 (2016.01); B60R 16/03 (2006.01); B62D 5/04 (2006.01)
CPC H02K 11/40 (2016.01) [B60R 16/03 (2013.01); B62D 5/0409 (2013.01); H02K 11/215 (2016.01); H02K 11/33 (2016.01); H02K 2211/03 (2013.01); H02K 2213/06 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A power conversion device comprising:
a power conversion circuit that is configured to convert a supplied electric power and to output the converted power; and
a multilayer substrate that includes the power conversion circuit, and has a wiring pattern,
wherein:
the wiring pattern of the multilayer substrate includes
a power supply pattern that is connected to a high potential side of the power conversion circuit to supply electric power, and
a ground pattern that is connected to a low potential side of the power conversion circuit;
the multilayer substrate includes a first layer and a second layer;
the power supply pattern includes a first layer power supply pattern portion in the first layer;
the ground pattern includes a second layer ground pattern portion in the second layer; and
the first layer power supply pattern portion and the second layer ground pattern portion overlap with each other at least in part in a direction perpendicular to a plate surface of the multilayer substrate,
the power conversion device further comprising:
a via that is installed in the multilayer substrate, and extends across the first layer and the second layer; and
a conductive member that is installed in the via, and
wherein:
the ground pattern further includes a first layer ground pattern portion in the first layer; and
the first layer ground pattern portion and the second layer ground pattern portion are electrically connected to each other by the conductive member installed in the via.