US 11,728,577 B2
Multi-layered antenna having dual-band patch
Dedi David Haziza, Kiryat Motzkin (IL)
Assigned to WAFER LLC, Hanover, NH (US); and SDEROTECH, INC., Wilmington, DE (US)
Filed by WAFER LLC, Hanover, NH (US); and SDEROTECH, INC., Wilmington, DE (US)
Filed on Nov. 9, 2020, as Appl. No. 17/92,618.
Claims priority of provisional application 62/936,283, filed on Nov. 15, 2019.
Prior Publication US 2021/0151900 A1, May 20, 2021
Int. Cl. H01Q 21/06 (2006.01); H01Q 5/342 (2015.01); H01Q 5/392 (2015.01); H01Q 1/38 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/38 (2013.01); H01Q 5/342 (2015.01); H01Q 5/392 (2015.01)] 20 Claims
OG exemplary drawing
 
1. An antenna comprising:
an insulating substrate;
a radiating patch provided over a top surface of the insulating substrate;
a first via formed in the insulating substrate, the first via being filled with conductive material contacting the radiating patch;
a capacitive patch provided over the top surface of the insulating substrate at a distance d from the radiating patch thereby forming a capacitor with the radiating patch;
a second via formed in the insulating substrate, the second via being filled with conductive material electrically contacting the capacitive patch;
a first delay line connected to the first via;
a second delay line connected to the second via;
a variable dielectric constant (VDC) plate;
a ground plane provided over a surface of the VDC plate; and
an inductive-capacitive circuit coupled to the radiating patch, wherein the inductive-capacitive circuit comprises an electrically floating patch provided over the top surface of the insulating substrate.