US 11,728,554 B2
Low-field assembled isolator
Fei Xiong, Guangdong (CN); and Wei Zhang, Guangdong (CN)
Assigned to Shenzhen Huayang Technology Development Co., Ltd., Shenzhen (CN)
Filed by Shenzhen Huayang Technology Development Co., Ltd., Guangdong (CN)
Filed on May 30, 2022, as Appl. No. 17/828,031.
Application 17/828,031 is a continuation of application No. PCT/CN2021/075702, filed on Feb. 7, 2021.
Claims priority of application No. 202021162623.6 (CN), filed on Jun. 22, 2020.
Prior Publication US 2022/0294094 A1, Sep. 15, 2022
Int. Cl. H01P 1/387 (2006.01); H01P 1/36 (2006.01)
CPC H01P 1/36 (2013.01) [H01P 1/387 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A low-field assembled isolator, comprising a rectangular body, wherein the body comprises an upper cavity and a lower cavity which are connected in a stacked manner; gaps are formed in four side surfaces of the body through the joint surfaces of the upper cavity and the lower cavity respectively; mounting members are respectively disposed on three of the side surfaces of the body; and the isolator further comprises a U-shaped magnetic circuit cover plate and two L-shaped magnetic circuit baffles, wherein the U-shaped magnetic circuit cover plate comprises an upper cover plate, a vertical plate and a lower cover plate which are connected in sequence; the upper cover plate abuts against the top surface of the body, the lower cover plate abuts against the bottom surface of the body, and the vertical plate abuts against a side surface, where no mounting member is disposed, of the body to seal the gaps in this side surface; and the two L-shaped magnetic circuit baffles are respectively disposed at two corners, away from the vertical plate, of the body so as to seal the joint between two adjacent gaps.