US 11,728,459 B2
Display module, display panel, and display apparatus
Kwangjae Lee, Suwon-si (KR); Sungsoo Jung, Suwon-si (KR); Kyungbae Kim, Suwon-si (KR); and Hyeongyeol Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 24, 2020, as Appl. No. 16/910,546.
Claims priority of application No. 10-2019-0096851 (KR), filed on Aug. 8, 2019.
Prior Publication US 2021/0043801 A1, Feb. 11, 2021
Int. Cl. H01L 33/08 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H01L 33/08 (2013.01) [H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H05K 1/189 (2013.01); H05K 7/20954 (2013.01); H05K 2201/10128 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A display apparatus comprising:
a display panel comprising:
a panel cover; and
a plurality of display modules removably attached to the panel cover, a display module of the plurality of display modules comprising a substrate on which a plurality of inorganic light emitting diodes is mounted;
a frame as a single body disposed to support the display panel, on which the plurality of display modules are installed and includes a board receiving portion recessed from a front surface of the frame;
a rear cover configured to accommodate the display panel and the frame;
at least one panel board arranged between the frame and the display panel and accommodated in the board receiving portion, and electrically connected to the plurality of display modules; and
a device board arranged between the frame and the rear cover, and electrically connected to the at least one panel board through the board receiving portion;
wherein the substrate comprises a mounting surface on which the plurality of inorganic light emitting diodes is mounted,
wherein the display module of the plurality of display modules further comprises:
a module plate attached to a surface opposite to the mounting surface of the substrate;
a boss mounting portion, formed by the module plate, mounted on the substrate of the display module and positioned on the surface opposite to the mounting surface of the substrate; and
a module Printed Circuit Board (PCB), electrically connected to the surface opposite to the mounting surface of the substrate,
wherein the module plate comprises an edge that exposes the boss mounting portion, and the module plate is between the substrate and the module PCB, and
wherein a thickness of a first part of the display module, in which the boss mounting portion is formed, is less than a thickness of a second part of the display module, in which the module plate is arranged.