US 11,728,363 B2
Solid-state imaging device, imaging device, and electronic apparatus
Keiji Nishida, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/250,626
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Aug. 8, 2019, PCT No. PCT/JP2019/031339
§ 371(c)(1), (2) Date Feb. 12, 2021,
PCT Pub. No. WO2020/039958, PCT Pub. Date Feb. 27, 2020.
Claims priority of application No. 2018-155518 (JP), filed on Aug. 22, 2018.
Prior Publication US 2021/0305302 A1, Sep. 30, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14627 (2013.01) [H01L 27/14621 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a transparent protective substrate;
a solid-state imaging element;
a bonding resin layer; and
a high refractive index layer in a light incident direction, wherein
a refractive index of the high refractive index layer is higher than a refractive index of one of the transparent protective substrate or a surface layer of an imaging surface of the solid-state imaging element,
a refractive index of the bonding resin layer is lower than the refractive index of the high refractive index layer,
the high refractive index layer is between the transparent protective substrate and the solid-state imaging element, and
the high refractive index layer is between the solid-state imaging element and the bonding resin layer.