US 11,728,361 B2
Imaging device and manufacturing method thereof
Norihiro Kubo, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 16/963,817
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Mar. 5, 2019, PCT No. PCT/JP2019/008598
§ 371(c)(1), (2) Date Jul. 21, 2020,
PCT Pub. No. WO2019/188043, PCT Pub. Date Oct. 3, 2019.
Claims priority of application No. 2018-058240 (JP), filed on Mar. 26, 2018.
Prior Publication US 2021/0057472 A1, Feb. 25, 2021
Int. Cl. H01L 27/14 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14623 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a photoelectric converter configured to generate a signal charge;
a charge holding section on a side of the photoelectric converter that is opposite to a light entrance side of the photoelectric converter, wherein the charge holding section is configured to hold the generated signal charge;
a light shielding section that includes a first light shielding surface between the charge holding section and the photoelectric converter; and
a vertical electrode section, wherein
the charge holding section has a specific surface parallel to the vertical electrode section,
the specific surface of the charge holding section and the vertical electrode section are parallel to a first direction, and
in a second direction perpendicular to the first direction, the first light shielding surface is between the vertical electrode section and the specific surface of the charge holding section.