US 11,728,360 B2
Image sensor packages formed using temporary protection layers and related methods
Larry Duane Kinsman, Boise, ID (US); Swarnal Borthakur, Boise, ID (US); Marc Allen Sulfridge, Boise, ID (US); Scott Donald Churchwell, Meridian, ID (US); and Brian Vaartstra, Nampa, ID (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jan. 14, 2022, as Appl. No. 17/576,268.
Application 16/282,495 is a division of application No. 15/285,197, filed on Oct. 4, 2016, granted, now 10,388,684, issued on Aug. 20, 2019.
Application 17/576,268 is a continuation of application No. 16/282,495, filed on Feb. 22, 2019, granted, now 11,342,369.
Prior Publication US 2022/0139982 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14621 (2013.01) [H01L 27/1462 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14632 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of forming an image sensor package comprising:
forming an encapsulation layer around a perimeter of one or more lenses, the encapsulation layer comprising a largest planar surface substantially parallel with a largest planar surface of a lens layer comprising the one or more lenses;
forming a temporary protection layer over the one or more lenses, the temporary protection layer formed through an opening in the encapsulation layer;
depositing a mold compound over the encapsulation layer, the mold compound comprising a largest planar surface substantially parallel with the largest planar surface of the lens layer; and
removing the temporary protection layer over the one or more lenses;
wherein a dam structure separates the encapsulation layer from the temporary protection layer.