CPC H01L 23/66 (2013.01) [H01L 21/4846 (2013.01); H01L 23/5223 (2013.01); H01L 23/5286 (2013.01); H01L 23/5381 (2013.01); H01L 23/5389 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 2223/6666 (2013.01); H01L 2223/6672 (2013.01)] | 22 Claims |
1. An apparatus, comprising:
a package substrate;
a capacitor die embedded in the package substrate, wherein the capacitor die is a single-sided capacitor die;
a surface mount die over the capacitor die, the surface mount die comprising a plurality of surface mount die interconnection structures facing the capacitor die;
a plurality of substrate vias between the capacitor die and the surface mount die; and
a short and direct connection coupling one of the plurality of surface mount die interconnection structures to the capacitor die, wherein the one of the plurality of surface mount die interconnection structures is vertically over the capacitor die.
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