US 11,728,290 B2
Waveguide fan-out
Adel A. Elsherbini, Chandler, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Johanna M. Swan, Scottsdale, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); and Henning Braunisch, Phoenix, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 25, 2019, as Appl. No. 16/394,514.
Claims priority of application No. 20190100140 (GR), filed on Mar. 22, 2019.
Prior Publication US 2020/0303327 A1, Sep. 24, 2020
Int. Cl. H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 24/97 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/1903 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A microelectronic package comprising:
a package substrate that includes a face and a substrate signal path, wherein the substrate signal path is positioned between two dielectric layers of the package substrate;
a first die and a second die coupled with the package substrate and communicatively coupled with the substrate signal path; and
a waveguide coupled with the face of the package substrate, wherein the waveguide is communicatively coupled with the first die and the second die;
wherein the waveguide is to carry an electromagnetic signal with a first frequency from the first die to the second die, and the substrate signal path is to carry an electromagnetic signal with a second frequency from the first die to the second die, and wherein the first frequency is greater than the second frequency.