CPC H01L 23/5223 (2013.01) [H01L 21/76843 (2013.01); H01L 23/528 (2013.01); H01L 28/40 (2013.01); H01L 28/91 (2013.01); H10B 12/033 (2023.02)] | 20 Claims |
1. An integrated circuit structure comprising:
a rectangular-shaped metal-insulator-metal (MIM) structure having rounded corners, wherein the rectangular-shaped MIM structure includes:
a first metal layer;
a first insulator layer disposed over the first metal layer;
a second metal layer disposed over the first insulator layer, the first insulator layer preventing the second metal layer from interfacing with the first metal layer;
a second insulator layer disposed over the second metal layer; and
a third metal layer disposed over the second insulator layer, the second insulator layer preventing the third metal layer from interfacing with the second metal layer, wherein a corner of the third metal layer is rounded.
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