US 11,728,261 B2
Chip on film package and display apparatus including the same
Duckgyu Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 7, 2021, as Appl. No. 17/314,567.
Claims priority of application No. 10-2020-0091751 (KR), filed on Jul. 23, 2020.
Prior Publication US 2022/0028777 A1, Jan. 27, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 23/3185 (2013.01); H01L 23/3672 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip-on-film (CoF) package, comprising:
a base film having an upper surface and a lower surface facing each other;
a conductive line on the upper surface of the base film;
a semiconductor chip on the upper surface of the base film and connected to the conductive line through a bump structure;
a heat radiator on the lower surface of the base film and underlying the semiconductor chip;
an adhesive layer between the lower surface of the base film and the heat radiator; and
a plurality of dam structures in the adhesive layer and overlapping the bump structure,
wherein, in plan view, the plurality of dam structures are discontinuously arranged in an island shape.