CPC H01L 21/6835 (2013.01) [B32B 3/085 (2013.01); B32B 3/266 (2013.01); B32B 5/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 38/1833 (2013.01); H01L 21/68742 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2371/00 (2013.01); B32B 2377/00 (2013.01); B32B 2457/14 (2013.01)] | 18 Claims |
1. An assembly for applying at least one feature to a semiconductor substrate chuck, the at least one feature being raised from the semiconductor substrate chuck to space a substrate from the chuck in use, the assembly comprising:
a carrier layer having first and second major sides,
a feature adhered to the first side of the carrier layer, and
a peel-ply layer adhered to the first side of the carrier layer to enclose the feature between the carrier layer and the peel-ply layer,
wherein the peel-ply layer is removable from the first side of the carrier layer,
wherein upon removal of the peel-ply layer the feature remains supported by the carrier layer,
wherein the feature is applied to a chuck by removal of the peel-ply layer and subsequently adhering the feature to the chuck.
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