US 11,728,199 B2
Substrate support features and method of application
I-Kuan Lin, Lexington, MA (US); Arthur Sommerstein, Marblehead, MA (US); Khanh Vo, Braintree, MA (US); and Kevin Barbera, Haverhill, MA (US)
Assigned to ASMPT NEXX, INC., Billerica, MA (US)
Filed by ASMPT NEXX, INC., Billerica, MA (US)
Filed on Dec. 23, 2019, as Appl. No. 16/724,614.
Prior Publication US 2021/0193496 A1, Jun. 24, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 21/687 (2006.01); B32B 7/12 (2006.01); B32B 27/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 5/02 (2006.01); B32B 37/12 (2006.01); B32B 3/08 (2006.01); B32B 37/00 (2006.01); B32B 38/18 (2006.01); B32B 7/06 (2019.01); B32B 37/08 (2006.01); B32B 38/10 (2006.01); B32B 7/14 (2006.01); B32B 37/06 (2006.01); B32B 3/26 (2006.01)
CPC H01L 21/6835 (2013.01) [B32B 3/085 (2013.01); B32B 3/266 (2013.01); B32B 5/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 38/1833 (2013.01); H01L 21/68742 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2371/00 (2013.01); B32B 2377/00 (2013.01); B32B 2457/14 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An assembly for applying at least one feature to a semiconductor substrate chuck, the at least one feature being raised from the semiconductor substrate chuck to space a substrate from the chuck in use, the assembly comprising:
a carrier layer having first and second major sides,
a feature adhered to the first side of the carrier layer, and
a peel-ply layer adhered to the first side of the carrier layer to enclose the feature between the carrier layer and the peel-ply layer,
wherein the peel-ply layer is removable from the first side of the carrier layer,
wherein upon removal of the peel-ply layer the feature remains supported by the carrier layer,
wherein the feature is applied to a chuck by removal of the peel-ply layer and subsequently adhering the feature to the chuck.