US 11,728,185 B2
Steam-assisted single substrate cleaning process and apparatus
Jianshe Tang, San Jose, CA (US); Wei Lu, Fremont, CA (US); Haosheng Wu, Santa Clara, CA (US); Taketo Sekine, Santa Clara, CA (US); Shou-Sung Chang, Mountain View, CA (US); Hari N. Soundararajan, Sunnyvale, CA (US); and Chad Pollard, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 5, 2021, as Appl. No. 17/141,622.
Prior Publication US 2022/0216074 A1, Jul. 7, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01); B08B 5/02 (2006.01); B08B 3/12 (2006.01); H01L 21/306 (2006.01)
CPC H01L 21/67051 (2013.01) [B08B 3/024 (2013.01); B08B 3/08 (2013.01); B08B 3/12 (2013.01); B08B 5/02 (2013.01); H01L 21/02057 (2013.01); H01L 21/30625 (2013.01); B08B 2203/007 (2013.01); B08B 2230/01 (2013.01); H01L 21/02074 (2013.01); H01L 21/67109 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for cleaning a substrate comprising:
a chamber having a substrate support and a back plate disposed therein;
a point of use (POU) nozzle disposed above the substrate support, the POU nozzle comprising a first conduit configured to be coupled to a fluid source and a second conduit configured to be coupled to a nitrogen source;
a front side nozzle assembly disposed above the substrate support, the front side nozzle assembly configured to be coupled to a first steam source and a first deionized water (DIW) source; and
a back side dispenser assembly disposed below the substrate support, the back side dispenser assembly configured to be coupled to a second steam source and a second DIW source.