CPC H01L 21/67051 (2013.01) [B08B 3/024 (2013.01); B08B 3/08 (2013.01); B08B 3/12 (2013.01); B08B 5/02 (2013.01); H01L 21/02057 (2013.01); H01L 21/30625 (2013.01); B08B 2203/007 (2013.01); B08B 2230/01 (2013.01); H01L 21/02074 (2013.01); H01L 21/67109 (2013.01)] | 20 Claims |
1. An apparatus for cleaning a substrate comprising:
a chamber having a substrate support and a back plate disposed therein;
a point of use (POU) nozzle disposed above the substrate support, the POU nozzle comprising a first conduit configured to be coupled to a fluid source and a second conduit configured to be coupled to a nitrogen source;
a front side nozzle assembly disposed above the substrate support, the front side nozzle assembly configured to be coupled to a first steam source and a first deionized water (DIW) source; and
a back side dispenser assembly disposed below the substrate support, the back side dispenser assembly configured to be coupled to a second steam source and a second DIW source.
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