US 11,728,097 B2
Multilayer electronic component
Min Hyang Kim, Suwon-si (KR); and Ga Young An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 24, 2021, as Appl. No. 17/484,642.
Claims priority of application No. 10-2020-0183608 (KR), filed on Dec. 24, 2020.
Prior Publication US 2022/0208469 A1, Jun. 30, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/08 (2006.01); H01G 4/224 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); H01G 4/224 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and
an external electrode disposed on the body,
wherein the external electrode includes:
an electrode layer connected to the internal electrode;
an Sn plating layer disposed on the electrode layer;
an Ni plating layer disposed on the Sn plating layer; and
a plating layer including Pd disposed on the Ni plating layer, and
wherein a thickness of the Sn plating layer from the electrode layer to the Ni plating layer is 0.02 to 0.1 μm.