US 11,728,095 B2
Electronic component
Beom Joon Cho, Suwon-si (KR); Seung Min Ahn, Suwon-si (KR); and Mi Na Hyun, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 30, 2021, as Appl. No. 17/460,887.
Claims priority of application No. 10-2020-0168786 (KR), filed on Dec. 4, 2020.
Prior Publication US 2022/0181086 A1, Jun. 9, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, the electronic component comprising:
a capacitor body;
an external electrode respectively disposed on one end of the capacitor body; and
a metal frame connected to the external electrode and mounted on the electrode pad of the substrate,
wherein the metal frame comprises first and second portions having respective outer surfaces which include different metals having different electrical conductivity.