CPC H01G 4/2325 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01)] | 20 Claims |
1. An electronic component which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, the electronic component comprising:
a capacitor body;
an external electrode respectively disposed on one end of the capacitor body; and
a metal frame connected to the external electrode and mounted on the electrode pad of the substrate,
wherein the metal frame comprises first and second portions having respective outer surfaces which include different metals having different electrical conductivity.
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