US 11,728,090 B2
Micro-scale device with floating conductive layer
Patrick M. McGuinness, Limerick (IE); Paul Lambkin, Limerick (IE); Laurence B. O'Sullivan, Limerick (IE); Bernard Patrick Stenson, Limerick (IE); Steven Tanghe, Limerick (IE); and Baoxing Chen, Limerick (IE)
Assigned to Analog Devices International Unlimited Company, Limerick (IE)
Filed by Analog Devices International Unlimited Company, Limerick (IE)
Filed on Feb. 10, 2020, as Appl. No. 16/786,928.
Prior Publication US 2021/0249185 A1, Aug. 12, 2021
Int. Cl. H01F 27/36 (2006.01); H01F 27/28 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01F 27/32 (2006.01)
CPC H01F 27/36 (2013.01) [H01F 27/2804 (2013.01); H01F 27/323 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An isolated micro-scale passive device configured to be disposed on a substrate comprising an upper surface, the isolated micro-scale passive device comprising:
a first planar conductor;
a second planar conductor configured to be disposed between the first planar conductor and the substrate;
an insulator layer disposed between the first planar conductor and the second planar conductor; and
a floating conductive layer in the insulator layer, wherein:
the first planar conductor has a first spacing from the floating conductive layer;
the second planar conductor has a second spacing from the floating conductive layer;
the first spacing is less than the second spacing such that the first spacing and the second spacing are configured to substantially balance a first capacitance of the isolated micro-scale passive device with a second capacitance of the isolated micro-scale passive device;
the first capacitance comprises:
a capacitance between the floating conductive layer and the second planar conductor; and
a capacitance between the floating conductive layer and the substrate; and
the second capacitance comprises a capacitance between the floating conductive layer and the first planar conductor.