US 11,727,184 B2
Integrated circuit including cells of different heights and method of designing the integrated circuit
Bonghyun Lee, Suwon-si (KR); and Jungho Do, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 29, 2022, as Appl. No. 17/877,483.
Application 17/877,483 is a continuation of application No. 17/183,630, filed on Feb. 24, 2021, granted, now 11,494,544.
Claims priority of application No. 10-2020-0103437 (KR), filed on Aug. 18, 2020.
Prior Publication US 2022/0382949 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 30/00 (2020.01); G06F 30/392 (2020.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01)
CPC G06F 30/392 (2020.01) [H01L 23/5286 (2013.01); H01L 27/0207 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) comprising:
a first column comprising a plurality of first power rails, each first power rail of the plurality of first power rails being configured to provide a first supply voltage or a second supply voltage to a plurality of first cells and extending in a first horizontal direction with a first pitch;
a second column comprising a plurality of second power rails configured to provide the first supply voltage or the second supply voltage to a plurality of second cells and extending in the first horizontal direction with a second pitch different from the first pitch; and
an interface column extending in a second horizontal direction perpendicular to the first horizontal direction between the first column and the second column,
wherein the interface column comprises a first power line extending in the second horizontal direction,
wherein the first power line is connected to a first group of the plurality of first power rails configured to provide the first supply voltage, and
wherein each power rail of the plurality of first power rails and the plurality of second power rails comprises at least one of:
a second conductive pattern buried in a substrate and extending in the first horizontal direction;
a source/drain contact extending in the first horizontal direction; and
a third conductive pattern extending in the first horizontal direction in a first wiring layer.