US 11,727,181 B2
Systems and methods for multi PF emulation using VFs in SSD controller
Ramdas P. Kachare, Pleasanton, CA (US); Stephen Fischer, San Jose, CA (US); and Oscar P. Pinto, San Jose, CA (US)
Assigned to SAMSUNG ELECTRONICS CO., LTD.
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 10, 2020, as Appl. No. 16/846,271.
Claims priority of provisional application 62/865,962, filed on Jun. 24, 2019.
Claims priority of provisional application 62/964,114, filed on Jan. 21, 2020.
Prior Publication US 2020/0401751 A1, Dec. 24, 2020
Int. Cl. G06F 30/39 (2020.01); G06F 30/392 (2020.01); G06F 13/40 (2006.01); G06F 30/347 (2020.01); G06F 13/10 (2006.01); G06F 15/17 (2006.01)
CPC G06F 30/392 (2020.01) [G06F 13/105 (2013.01); G06F 13/4027 (2013.01); G06F 30/347 (2020.01); G06F 13/10 (2013.01); G06F 15/17 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bridge circuit, comprising:
an endpoint to connect to a host, the endpoint exposing a first Physical Function (PF) and a second PF;
a root port to connect to a device, the device exposing to the root port a third PF and a Virtual Function (VF); and
an Application Layer-End Point (APP-EP) and an Application Layer-Root Port (APP-RP) to translate between the first PF and the second PF exposed to the host and the third PF and the VF exposed by the device,
wherein the APP-EP and the APP-RP implement a mapping between the first PF and the second PF exposed by the endpoint and the third PF and the VF exposed by the device.