US 11,726,278 B2
Free air intrasystem interconnect
Arvind Sundaram, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 3, 2022, as Appl. No. 17/685,922.
Application 17/685,922 is a continuation of application No. 16/326,443, granted, now 11,294,127, previously published as PCT/US2016/054380, filed on Sep. 29, 2016.
Prior Publication US 2022/0187552 A1, Jun. 16, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4246 (2013.01) [G02B 6/421 (2013.01); G02B 6/4204 (2013.01); G02B 6/4257 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a communication interface configured to be coupled to a chip carrier, the communication interface including at least one optical transmitter receiver pair that includes:
a laser emitter configured to transmit laser energy to a first optical waveguide;
a photodiode disposed adjacent to the laser emitter and configured to detect laser energy communicated from a second optical waveguide; and
an optical bandpass filter disposed at the photodiode and having a passband that excludes the center frequency of the transmit laser frequency.