CPC G02B 6/4215 (2013.01) [G02B 6/2934 (2013.01); G02B 6/4249 (2013.01); G02B 6/4295 (2013.01); G02B 6/43 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); B81B 2201/045 (2013.01)] | 20 Claims |
1. A photonics transceiver comprising:
a first chip that includes a plurality of light sources, each of the plurality of light sources adapted to continuously emit a corresponding wavelength of light, each of the plurality of light sources includes a corresponding vertical cavity surface emitting laser (VCSEL), the plurality of VCSELs formed on a non-planar substrate, the non-planar substrate including a ridge, the ridge including a tapered width;
a second chip that includes a plurality of photodetectors, each of the plurality of photodetectors adapted to produce a corresponding signal indicative of a received magnitude of light;
a third chip that includes:
Tx componentry including a wavelength division multiplexer, the wavelength division multiplexer including a first plurality of tunable ring resonators, and each of the first plurality of tunable ring resonators being optically coupled to a respective one of the plurality of light sources; and
Rx componentry including a wavelength division demultiplexer, the wavelength division demultiplexer including a second plurality of tunable ring resonators, and each of the second plurality of tunable ring resonators being optically coupled to a respective one of the plurality of photodetectors; and
a fourth chip that comprises control/logic circuitry that is electrically coupled to the first chip, the second chip, and the third chip.
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