US 11,726,276 B1
Multi-chip photonics transceiver
Michael Wood, Albuquerque, NM (US); Alejandro J. Grine, Albuquerque, NM (US); Darwin K. Serkland, Albuquerque, NM (US); Bryan James Kaehr, Albuquerque, NM (US); Andrew E. Hollowell, Albuquerque, NM (US); Gregory M. Peake, Albuquerque, NM (US); Alexander Ruyack, Albuquerque, NM (US); and Sam Palermo, College Station, TX (US)
Assigned to National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US); and The Texas A&M University System, College Station, TX (US)
Filed by National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US); and The Texas A&M University System, College Station, TX (US)
Filed on Aug. 2, 2021, as Appl. No. 17/391,167.
Claims priority of provisional application 63/061,314, filed on Aug. 5, 2020.
Claims priority of provisional application 63/061,301, filed on Aug. 5, 2020.
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/40 (2013.01); G02B 6/293 (2006.01); H04B 10/50 (2013.01)
CPC G02B 6/4215 (2013.01) [G02B 6/2934 (2013.01); G02B 6/4249 (2013.01); G02B 6/4295 (2013.01); G02B 6/43 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); B81B 2201/045 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photonics transceiver comprising:
a first chip that includes a plurality of light sources, each of the plurality of light sources adapted to continuously emit a corresponding wavelength of light, each of the plurality of light sources includes a corresponding vertical cavity surface emitting laser (VCSEL), the plurality of VCSELs formed on a non-planar substrate, the non-planar substrate including a ridge, the ridge including a tapered width;
a second chip that includes a plurality of photodetectors, each of the plurality of photodetectors adapted to produce a corresponding signal indicative of a received magnitude of light;
a third chip that includes:
Tx componentry including a wavelength division multiplexer, the wavelength division multiplexer including a first plurality of tunable ring resonators, and each of the first plurality of tunable ring resonators being optically coupled to a respective one of the plurality of light sources; and
Rx componentry including a wavelength division demultiplexer, the wavelength division demultiplexer including a second plurality of tunable ring resonators, and each of the second plurality of tunable ring resonators being optically coupled to a respective one of the plurality of photodetectors; and
a fourth chip that comprises control/logic circuitry that is electrically coupled to the first chip, the second chip, and the third chip.