US 11,726,148 B2
Sensor devices having soft magnets and associated production methods
Rainer Markus Schaller, Saal an der Donau (DE); and Volker Strutz, Tegernheim (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 9, 2022, as Appl. No. 17/836,204.
Claims priority of application No. 102021114943.6 (DE), filed on Jun. 10, 2021.
Prior Publication US 2022/0397617 A1, Dec. 15, 2022
Int. Cl. G01R 33/07 (2006.01); G01R 15/20 (2006.01)
CPC G01R 33/07 (2013.01) [G01R 15/202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor device, comprising:
a current conductor configured to carry a measurement current;
a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is configured to detect a magnetic field at a location of the sensor element;
an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material; and
a soft magnet secured to the encapsulation material and configured to concentrate the magnetic field at the location of the sensor element,
wherein the magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.