US 11,726,137 B2
Thermal conditioning of electronic devices under test based on extensible elements
Fabrizio Scocchetti, Todi (IT)
Assigned to ELES SEMICONDUCTOR EQUIPMENT S.P.A., Todi (IT)
Appl. No. 17/611,842
Filed by ELES Semiconductor Equipment S.p.A., Todi (IT)
PCT Filed May 15, 2020, PCT No. PCT/IT2020/050121
§ 371(c)(1), (2) Date Nov. 16, 2021,
PCT Pub. No. WO2020/234907, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 102019000006974 (IT), filed on May 17, 2019.
Prior Publication US 2022/0214396 A1, Jul. 7, 2022
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2863 (2013.01) [G01R 31/2874 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A thermal conditioning device for conditioning a plurality of electronic devices under test thermally,
wherein
the thermal conditioning device comprises:
a plurality of extensible elements with variable length each for conditioning a corresponding one of the electronic devices thermally in an individual manner,
a process circulation system for circulating a process heat-conductive fluid in the extensible elements
a process heat exchange system for exchanging heat with the process heat-conductive fluid, and
a pressure regulation system for regulating a pressure of the process heat-conducting fluid to move the extensible elements between a shortened condition and a lengthened condition, each of the extensible elements in the lengthened condition being pressed against the corresponding electronic device.