US 11,726,062 B2
Magnetic layer characterization system and method
Chia-Hsiang Chen, Hsinchu (TW); Chia Yu Wang, Hsinchu (TW); and Meng-Chun Shih, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company LTD, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 5, 2021, as Appl. No. 17/308,360.
Claims priority of provisional application 63/163,317, filed on Mar. 19, 2021.
Prior Publication US 2022/0299474 A1, Sep. 22, 2022
Int. Cl. G01N 27/72 (2006.01); H01P 3/00 (2006.01); H01F 7/02 (2006.01)
CPC G01N 27/72 (2013.01) [H01F 7/02 (2013.01); H01P 3/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A test device for measuring at least one magnetic parameter of an associated multilayer structure containing a magnetic layer, the test device comprising:
a waveguide having a recess configured to receive and hold the associated multilayer structure with the waveguide electromagnetically coupled with the associated multilayer structure received by the recess of the waveguide;
a magnet arranged to superimpose a magnetic field on the associated multilayer structure and a magnetic field sensor; and
a network analyzer configured to measure network parameters of the waveguide holding and electromagnetically coupled with the associated multilayer structure received by the recess of the waveguide with the magnet superimposing the magnetic field on the associated multilayer structure received by the recess of the waveguide.